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Chip scale Schottky cuts board space by 70%
Topic Started: Jun 11 2013, 01:45 PM (40 Views)
StillTedd
Newbie
[ * ]


Diodes has introduced its first wafer level chip scale packaged Schottky, which it says offers twice the power density for the same pcb footprint as miniature DFN0603 devices.

Available in a X3-WLCUS0603-3 solder pad package, the 30V, 0.2A SDM0230CSP has a typical thermal resistance of 261ºC/W and is suited to high density designs such as smartphones and tablets.

The Schottky has a low maximum forward voltage of 0.5V for a forward current of 0.2A and a typical low leakage current of 1.5mA at a reverse voltage of 30V.

Diodes claims the device utilises 70% less board space and is 25% thinner than industry standard DFN1006 and SOD923 packaged Schottkys.
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